Title :
Block-by-block link-path analysis and design with physics-based models
Author_Institution :
UMR/MS&T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO
Abstract :
A collection of slides from the author´s conference presentation is given.
Keywords :
electromagnetic compatibility; metallisation; printed circuits; strip lines; EMC; TEM field; block-by-block link-path analysis; material discontinuity; multilayered PCB; stripline;
Conference_Titel :
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4244-1699-8
Electronic_ISBN :
978-1-4244-1698-1
DOI :
10.1109/ISEMC.2008.4652245
