DocumentCode :
3117765
Title :
Degradation of epoxy lens materials in LED systems
Author :
Koh, S. ; Van Driel, Willem ; Zhang, G.Q.
Author_Institution :
Delft Inst. of Microsyst. & Nanoelectron. (Dimes), Delft Univ. of Technol., Delft, Netherlands
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42374
Lastpage :
42495
Abstract :
Due to their long lifetime and high efficacy, solid state lighting (SSL) has the potential to revolutionize the illumination industry. The long lifetime claimed by the manufacturers is often based solely on the estimated depreciation of lumen for a single LED operating at 25°C. However, self heating and high environmental temperature which will lead to increased junction temperature and degradation due to electrical overstress can shorten the life of light emitting diode. Furthermore, each SSL system includes different components such as the optical part, electrical driver and interconnections. The failure/degradation of any components will severely affects the performance and reliability of whole system and hence the weakest component will become the bottleneck for the reliability and lifetime of the module. Literature reviews of the factors influencing the life of LED lamps identified the degradation of the epoxy lens and plastic package due to the junction temperature and voltages as one of the common failure mode. In this research, a methodology to predict the degradation of the epoxy lens has been proposed. In order to correlate the mean time to failure as a function of the junction temperature and the inputted voltage, the simplified Eyring models had been proposed in this research. Since the life of a SSL system is subjected to varying loading condition, another objectives of this research is to present a methodology to predict the life of a SSL under changing condition.
Keywords :
failure analysis; light emitting diodes; lighting; plastic packaging; Eyring models; LED lamps; LED systems; epoxy lens material degradation; failure degradation; illumination industry; junction temperature; light emitting diode; plastic package; reliability; solid state lighting; temperature 25 degC; Computational modeling; Degradation; Heating; Light emitting diodes; Stimulated emission; Temperature; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765850
Filename :
5765850
Link To Document :
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