DocumentCode :
3117813
Title :
New high performance parallel bonded fine enamelled wire for hard disk drive head
Author :
Takahashi, S. ; Hanaoka, K. ; Chabata, S. ; Tsuboi, T. ; Ito, K. ; Yotsuya, K.
Author_Institution :
Fujikura Ltd., Tokyo, Japan
fYear :
1989
fDate :
25-28 Sep 1989
Firstpage :
173
Lastpage :
179
Abstract :
Data are presented characterizing high-performance parallel bonded fine enamelled wires which have been applied to HDD (hard disk drive) heads. This wire {OFC 2P-UEWB(RG)SL} is shown to be superior in mechanical strength, electrical insulation properties, and high-frequency characteristics to the single wire which has been widely used for HDD heads. This parallel wire has the same clean solderability, chemical resistance, and thermal life as single wire. In addition, the parallel wire has excellent automatic windability, and it has better hand-windability than single wire. Special oxygen-free copper-type parallel bonded wire {AOFC 2P-UEWB(RG)SL} is very suitable for finer size wire
Keywords :
hard discs; insulated wires; magnetic heads; HDD; automatic windability; chemical resistance; electrical insulation properties; hand-windability; hard disk drive head; high-frequency characteristics; mechanical strength; parallel bonded fine enamelled wire; solderability; thermal life; Bonding; Coils; Disk drives; Fluctuations; Hard disks; Inductance; Magnetic heads; Mechanical factors; Research and development; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/EEIC.1989.208219
Filename :
208219
Link To Document :
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