• DocumentCode
    3118052
  • Title

    Reliability of semiconductor devices - The need for simulation

  • Author

    Kanert, Werner

  • Author_Institution
    Infineon Technol. AG, Neubiberg, Germany
  • fYear
    2011
  • fDate
    18-20 April 2011
  • Firstpage
    42374
  • Lastpage
    42495
  • Abstract
    Reliability requirements for semiconductor devices have increased tremendously in the past years. However, product qualification is still dominated by standard stress test procedures. Despite improved approaches that have entered the discussion recently, testing alone will not suffice to prove very low failure rates. Understanding of the device behaviour together with physical modelling is indispensable. Simulation plays a key role in this undertaking.
  • Keywords
    semiconductor device reliability; device behaviour; failure rates; physical modelling; semiconductor device reliability; Atmospheric modeling; Automotive engineering; Lead; Materials; Materials reliability; Robustness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
  • Conference_Location
    Linz
  • Print_ISBN
    978-1-4577-0107-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2011.5765861
  • Filename
    5765861