Title :
Reliability of semiconductor devices - The need for simulation
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
Abstract :
Reliability requirements for semiconductor devices have increased tremendously in the past years. However, product qualification is still dominated by standard stress test procedures. Despite improved approaches that have entered the discussion recently, testing alone will not suffice to prove very low failure rates. Understanding of the device behaviour together with physical modelling is indispensable. Simulation plays a key role in this undertaking.
Keywords :
semiconductor device reliability; device behaviour; failure rates; physical modelling; semiconductor device reliability; Atmospheric modeling; Automotive engineering; Lead; Materials; Materials reliability; Robustness;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
DOI :
10.1109/ESIME.2011.5765861