DocumentCode
3118052
Title
Reliability of semiconductor devices - The need for simulation
Author
Kanert, Werner
Author_Institution
Infineon Technol. AG, Neubiberg, Germany
fYear
2011
fDate
18-20 April 2011
Firstpage
42374
Lastpage
42495
Abstract
Reliability requirements for semiconductor devices have increased tremendously in the past years. However, product qualification is still dominated by standard stress test procedures. Despite improved approaches that have entered the discussion recently, testing alone will not suffice to prove very low failure rates. Understanding of the device behaviour together with physical modelling is indispensable. Simulation plays a key role in this undertaking.
Keywords
semiconductor device reliability; device behaviour; failure rates; physical modelling; semiconductor device reliability; Atmospheric modeling; Automotive engineering; Lead; Materials; Materials reliability; Robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location
Linz
Print_ISBN
978-1-4577-0107-8
Type
conf
DOI
10.1109/ESIME.2011.5765861
Filename
5765861
Link To Document