DocumentCode :
3118094
Title :
Buckling analysis of carbon nanotubes and the influence of defect position
Author :
Poelma, R.H. ; Sadeghian, H. ; Koh, Sau ; Zhang, G.Q.
Author_Institution :
Delft Univ. of Technol., Delft, Netherlands
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42376
Lastpage :
42558
Abstract :
In this paper, the buckling behavior of fixed-fixed, both single- and multi- wall carbon nanotubes (CNTs) under axial compressive loads, are studied using analytical continuum theory and molecular dynamics (MD). An approach based on the tethering of atoms, is used to apply the boundary conditions and extract the reaction forces during the MD simulation. Both the analytical and the MD results agree well for slender CNTs (length=diameter = L/D ≥ 9), that show global buckling. The critical buckling load of non slender CNTs (L/D <; 9) is overestimated by the analytical model due to the local buckling. Moreover, the effects of the vacancy defect position on the critical buckling load are studied at room temperature and at low temperature (1 K). It is concluded that the defects at the ends of the CNT and close to the middle of the CNT significantly reduce the critical buckling load and strain of CNTs at 1 K. However, the influence of vacancy defects on the critical buckling load and strain appears to be small at room temperature. The MD results can be used for developing more computationally efficient and accurate continuum descriptions of the CNT mechanics in future work.
Keywords :
buckling; carbon nanotubes; compressive strength; defect states; molecular dynamics method; C; analytical continuum theory; axial compressive loads; boundary conditions; buckling analysis; critical buckling; molecular dynamics; multiwall carbon nanotubes; reaction forces; single-wall carbon nanotubes; temperature 1 K; temperature 293 K to 298 K; vacancy defect position; Deformable models; Dynamics; Force; Geometry; Lead; Simulation; Strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765864
Filename :
5765864
Link To Document :
بازگشت