• DocumentCode
    3118135
  • Title

    The impact of inorganic fillers in unsaturated polyester resins

  • Author

    Winkeler, Mark

  • Author_Institution
    P.D. George Co., St. Louis, MO, USA
  • fYear
    1989
  • fDate
    25-28 Sep 1989
  • Firstpage
    250
  • Lastpage
    257
  • Abstract
    Recently, concern has been expressed as to the effects fillers have on the long-term performance of a resin utilizing inorganic filler. The author examines four different inorganic fillers, focusing on various performance properties as well as the practical aspects of using a resin containing inorganic filler. The fillers are silica, slate flour, talc, and a silica and hydrated alumina mixture. An assessment is made of the advantages and disadvantages of utilizing inorganic fillers in electrical insulating resins. From the data presented it is seen that inorganic fillers affect such liquid properties as viscosity and thixotropic index. They may also affect the pot life as measured by the gel time. The thermal and mechanical properties may be affected as well. However, the data seem to show minimal effects on the thermal and mechanical performance. In general, inorganic fillers seem to enhance the various performance properties of the unsaturated polyester resins tested. However, there are possible disadvantages, such as settling or an increase of viscosity to an undesirable level
  • Keywords
    filled polymers; organic insulating materials; thixotropy; viscosity; electrical insulating resins; gel time; hydrated alumina; inorganic fillers; mechanical properties; pot life; silica; slate flour; talc; thermal properties; thixotropic index; unsaturated polyester resins; viscosity; Costs; Dielectrics and electrical insulation; Electrical products; Electrical products industry; Insulation testing; Performance evaluation; Polymers; Resins; Silicon compounds; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/EEIC.1989.208235
  • Filename
    208235