A 10 Gb/s package for digital ICs

Author

Hacker, J.B. ; Banwell, T.C. ; Kong, D.T.

Author_Institution

Bellcore, Red Bank, NJ, USA

Volume

2

fYear

1997

fDate

8-13 June 1997

Firstpage

473

Abstract

Experimental research prototype packages with 26 10 Gb/s I/O ports were designed for two GaAs telecom ICs. The prototypes are based upon a commercially available ceramic microwave package with an exterior size of 0.450" square, and an interior cavity size of 0.250" square. The copper-tungsten base provides excellent heat dissipation and rigidity while providing a close thermal expansion match to GaAs. A 5 mil alumina substrate is used to carry microstrip transmission line circuits from the package edge to the die mounted at the package center. A low-inductance ground ring surrounds the die cavity in the package to provide flexible low-noise grounding of the die without compromising signal integrity on the high-speed lines. Measurements show the package has usable bandwidth to 35 GHz and crosstalk is better than -35 dB for adjacent high-speed signal paths. The results demonstrate that packaging need not be the limiting factor for complex high-speed digital integrated circuits.

Keywords

III-V semiconductors; SONET; bipolar digital integrated circuits; crosstalk; demultiplexing equipment; gallium arsenide; integrated circuit noise; integrated circuit packaging; microstrip circuits; thermal expansion; 1 to 35 GHz; 10 Gb/s package; 10 Gbit/s; 5 mil; Al/sub 2/O/sub 3/; Al/sub 2/O/sub 3/ substrate; Cu-W base; CuW; GaAs; GaAs HBT die; GaAs digital ICs; I/O ports; SONET; adjacent high-speed signal paths; ceramic microwave package; crosstalk; die cavity; exterior size; flexible low-noise grounding; heat dissipation; high-speed digital integrated circuits; interior cavity size; low-inductance ground ring; microstrip transmission line circuits; rigidity; telecom ICs; thermal expansion match; usable bandwidth; Ceramics; Distributed parameter circuits; Electromagnetic heating; Gallium arsenide; Grounding; Integrated circuit packaging; Microstrip; Prototypes; Telecommunications; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1997., IEEE MTT-S International

Conference_Location

Denver, CO, USA

ISSN

0149-645X

Print_ISBN

0-7803-3814-6

Type

conf

DOI

10.1109/MWSYM.1997.602835

Filename

602835