New highly reliable heat resistant magnet wire and epoxy potting compound system for electrical devices

Author

Okada, Yasunori ; Kasai, Shozo ; Obara, Mitsuo ; Aimono, Yuji

Author_Institution

Hitachi Chem. Co. Ltd., Ibaraki, Japan

fYear

1989

fDate

25-28 Sep 1989

Firstpage

284

Lastpage

288

Abstract

A new highly reliable molding system is presented. The system consists of a new heat-resistant polyurethane magnet wire that exhibits good heat resistance, solderability, and productivity, and a new halogen-type flame-retardant epoxy potting compound that exhibits good heat resistance, humidity resistance, and impregnation rate. The system meets recent market requirements connected with office and factory automation and high-definition television and display technologies. The authors outline the technical steps taken to develop these two materials and describe their properties when they are taken separately and in combination

Keywords

insulated wires; organic insulating materials; thermal resistance; electrical devices; epoxy potting compound system; factory automation; halogen-type flame-retardant epoxy; heat resistant magnet wire; heat-resistant polyurethane; high-definition television; humidity resistance; impregnation rate; market requirements; productivity; solderability; Coils; Electric resistance; Humidity; Life testing; Magnetic devices; Magnetic materials; Magnetic properties; Resistance heating; System testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th

Conference_Location

Chicago, IL

Type

conf

DOI

10.1109/EEIC.1989.208242

Filename

208242