DocumentCode :
3118299
Title :
New highly reliable heat resistant magnet wire and epoxy potting compound system for electrical devices
Author :
Okada, Yasunori ; Kasai, Shozo ; Obara, Mitsuo ; Aimono, Yuji
Author_Institution :
Hitachi Chem. Co. Ltd., Ibaraki, Japan
fYear :
1989
fDate :
25-28 Sep 1989
Firstpage :
284
Lastpage :
288
Abstract :
A new highly reliable molding system is presented. The system consists of a new heat-resistant polyurethane magnet wire that exhibits good heat resistance, solderability, and productivity, and a new halogen-type flame-retardant epoxy potting compound that exhibits good heat resistance, humidity resistance, and impregnation rate. The system meets recent market requirements connected with office and factory automation and high-definition television and display technologies. The authors outline the technical steps taken to develop these two materials and describe their properties when they are taken separately and in combination
Keywords :
insulated wires; organic insulating materials; thermal resistance; electrical devices; epoxy potting compound system; factory automation; halogen-type flame-retardant epoxy; heat resistant magnet wire; heat-resistant polyurethane; high-definition television; humidity resistance; impregnation rate; market requirements; productivity; solderability; Coils; Electric resistance; Humidity; Life testing; Magnetic devices; Magnetic materials; Magnetic properties; Resistance heating; System testing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/EEIC.1989.208242
Filename :
208242
Link To Document :
بازگشت