DocumentCode
311853
Title
A flip chip bonding technology using gold pillars for millimeter-wave applications
Author
Aoki, S. ; Someta, H. ; Yokokawa, S. ; Ono, K. ; Hirose, T. ; Ohashi, Y.
Author_Institution
Fujitsu Labs. Ltd., Atsugi, Japan
Volume
2
fYear
1997
fDate
8-13 June 1997
Firstpage
731
Abstract
This paper reports a flip chip bonding technology for a millimeter-wave monolithic integrated circuit (MIMIC) using gold micropillars with a controlled air gap instead of conventional wire bonding. We focus on their electrical performance in the W-band and their reliability against stresses expected in automotive radar applications.
Keywords
MIMIC; flip-chip devices; gold; integrated circuit technology; Au; W-band; air gap; automotive radar; electrical performance; flip chip bonding technology; gold pillar; millimeter-wave monolithic integrated circuit; reliability; stress; Automotive engineering; Bonding; Flip chip; Gold; Integrated circuit reliability; Integrated circuit technology; MIMICs; Radar applications; Stress; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.602894
Filename
602894
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