DocumentCode :
3118691
Title :
Ionic and thermal conductivity studies of silicone-dammar as a coating resin
Author :
Zakaria, Rabih ; Ahmad, A.H.
Author_Institution :
Fac. of Appl. Sci., Univ. Teknol. MARA, Shah Alam, Malaysia
fYear :
2012
fDate :
23-26 Sept. 2012
Firstpage :
401
Lastpage :
404
Abstract :
Dammar is a natural resin was mixed with silicone resin (SD) to be new modified silicone coating binder. The sample was varied by weight % and designated as SD0, SD5, SD10, SD15, SD20, SD25, SD30, SD35, SD40 and SD45. The dried coating film layer was coated on aluminum q-panel using spin coater. The cured sample was mounted an open tube and filled with 3% of sodium chloride to measure ion conductivity using impedance spectroscopy (EIS). While a custom chamber was made to act sandwich like chamber to measure thermal conductivity of the cured sample As the result, SD15 and SD25 show higher coating resistance at 6.0E+06 and 8.0E+06 S/cm respectively. However ionic transference number showed the ionic activity up to 1.0V in SD10, SD15 and SD25. Thus, SD5, SD10 and SD15 show the low of k-value at 0.01, 0.02 and 0.03 W/mK respectively. XRD spectra indicate the dammar content could influent the ionic and thermal conductivity of SD coating resin when sharp peak of silicone resin gives the different intensity at SD10, SD15, SD20 and SD25.
Keywords :
coatings; curing; electric resistance; electrochemical impedance spectroscopy; ionic conductivity; resins; silicones; spin coating; thermal conductivity; EIS; aluminum q-panel; coating resistance; curing; dammar content; dried coating film layer; impedance spectroscopy; ionic activity; ionic conductivity; ionic transference number; mixing; modified silicone coating binder; natural resin; open tube; sandwich like chamber; silicone resin peak; silicone-dammar coating resin; spin coater; thermal conductivity; Coatings; Conductivity; Heat transfer; Resins; Resistance; Temperature measurement; Coating resistance; EIS; Thermal conductivity; ionic conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Business, Engineering and Industrial Applications (ISBEIA), 2012 IEEE Symposium on
Conference_Location :
Bandung
Print_ISBN :
978-1-4577-1632-4
Type :
conf
DOI :
10.1109/ISBEIA.2012.6422914
Filename :
6422914
Link To Document :
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