Evaluating Optical Contact Bonds Using Thin-Film ZnO Transducers

Author

Hickernell, Fred S.

Author_Institution

Arizona Univ., Tucson, AZ

fYear

2006

fDate

38869

Firstpage

338

Lastpage

342

Abstract

The bond integrity between optically bonded fused quartz blocks has been evaluated using ultrasonic waves in the frequency range from 200 MHz to 800 MHz. The ultrasonic waves were produced by thin-film zinc oxide (ZnO) transducers. By excitation of the thin film ZnO transducers on glass blocks of two different thicknesses and optically bonding their free surfaces opposite the transducers, the properties of the bonded area can be evaluated using transmission and reflection loss measurements. The measurements were made using pulse excitation and detection, and spectrum analyzer measurements

Keywords

II-VI semiconductors; adhesive bonding; optical variables measurement; oxygen compounds; quartz; semiconductor thin films; ultrasonic measurement; ultrasonic transducers; zinc compounds; 200 to 800 MHz; ZnO; bond integrity; optical contact bonds; optically bonded fused quartz blocks; pulse detection; pulse excitation; reflection loss measurements; spectrum analyzer measurements; thin-film zinc oxide transducers; transmission loss measurements; ultrasonic waves; Bonding; Frequency; Glass; Optical films; Optical surface waves; Pulse measurements; Transistors; Ultrasonic transducers; Ultrasonic variables measurement; Zinc oxide;

fLanguage

English

Publisher

ieee

Conference_Titel

International Frequency Control Symposium and Exposition, 2006 IEEE

Conference_Location

Miami, FL

Print_ISBN

1-4244-0074-0

Electronic_ISBN

1-4244-0074-0

Type

conf

DOI

10.1109/FREQ.2006.275409

Filename

4053787