A three-dimensional active antenna for a high-speed wireless communication application

This paper proposes a three-dimensional active antenna configuration for a front-end module of a high-speed wireless communication system at millimeter and quasi-millimeter-wave frequencies. The active antenna is integrated with a microstrip antenna array on multilayer alumina-ceramic, individual MMIC chips including transmit/receive amplifiers, time division duplex switches, and a filter on multilayer polyimide. The three-dimensional structure achieves an unrestricted RF-circuit design on multilayer polyimide.