• DocumentCode
    3119052
  • Title

    Drift of magnetic sensitivity of smart Hall sensors due to moisture absorbed by the IC-package [automotive applications]

  • Author

    Ausserlechner, U. ; Motz, Markus ; Holliber, M.

  • Author_Institution
    Infineon Technol. AG., Austria
  • fYear
    2004
  • fDate
    24-27 Oct. 2004
  • Firstpage
    455
  • Abstract
    For automotive applications like cam-shaft, crank-shaft, throttle valve or accelerator pedal position sensing, Hall probes are integrated together with biasing and complex signal processing circuits into tiny plastic packages. Instabilities of magnetic switching points and magnetic sensitivity have been observed for some time. We show by way of experiments that the main contribution to this sensitivity drift originates from moisture absorption by the mold compound of the plastic package which changes the mechanical stress on the die. The mechanical stress affects the Hall factor of the Hall probe (piezo-Hall effect) and the current through the Hall probe (piezo-resistance effect) which finally leads to a drift of the overall magnetic sensitivity.
  • Keywords
    Hall effect; Hall effect transducers; automotive electronics; integrated circuit packaging; intelligent sensors; internal stresses; moisture; piezoelectricity; plastic packaging; sensitivity; sorption; Hall factor; Hall probes; Hall sensor magnetic sensitivity drift; IC-package moisture absorption; accelerator pedal position sensing; automotive sensors; cam-shaft sensing; crank-shaft sensing; die mechanical stress affects; magnetic switching point instabilities; mold compound moisture absorption; piezo-Hall effect; piezo-resistance effect; plastic packages; signal processing circuits; smart Hall sensors; throttle valve sensing; Automotive applications; Circuits; Hall effect devices; Intelligent sensors; Magnetic sensors; Moisture; Plastic packaging; Signal processing; Stress; Valves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2004. Proceedings of IEEE
  • Print_ISBN
    0-7803-8692-2
  • Type

    conf

  • DOI
    10.1109/ICSENS.2004.1426198
  • Filename
    1426198