Folded silicon resonant accelerometer with temperature compensation

Author

He, Lin ; Xu, Yong-Ping ; Qiu, Anping

Author_Institution

Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore

fYear

2004

fDate

24-27 Oct. 2004

Firstpage

512

Abstract

In this paper, a novel folded silicon resonant accelerometer is proposed. The proposed structure is able to release the stress arising from the mismatch of thermal expansion between silicon structure and glass substrate and to compensate the variation of the natural frequency with temperature. The analysis has shown that both bias and scale factor stability can be improved with the proposed structure. The concept is verified by simulation and the results show that the temperature dependence of common-mode output frequency can be greatly reduced.

Keywords

Young´s modulus; accelerometers; elemental semiconductors; error compensation; micromechanical resonators; microsensors; silicon; thermal expansion; thermal stability; MEMS; Si; Young´s modulus; bias stability; common-mode output frequency temperature dependence; dissolved wafer process; folded resonant accelerometer; glass substrate; micromachined accelerometers; natural frequency temperature dependency; scale factor stability; temperature compensation; temperature stability; thermal expansion mismatch stress release; Acceleration; Accelerometers; Frequency; Glass; Resonance; Silicon; Stability; Temperature dependence; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2004. Proceedings of IEEE

Print_ISBN

0-7803-8692-2

Type

conf

DOI

10.1109/ICSENS.2004.1426213

Filename

1426213