DocumentCode :
3119421
Title :
Modeling modern bipolar technologies to insure design for manufacturability
Author :
Bouknight, James Lyle ; Leibiger, Steven M. ; Yakabu, Kyle S. ; Hingarh, Hem K.
Author_Institution :
Nat. Semicond. Corp., Puyallup, WA, USA
fYear :
1988
fDate :
16-19 May 1988
Abstract :
A description is given of an integrated empirical modeling methodology which has been successfully applied in modeling the ASPECT process (Advanced Single Poly Emitter Coupled Technology) to ensure manufacturable circuit designs. The accuracy which has been achieved with this degree of modeling has contributed significantly to realizing `right the first time´ designs on a number of standard cell VLSI ECL (emitter-coupled logic) designs. A comprehensive test chip was used to construct a database composed of both single-point and multipoint measurements along with capacitance voltage behavior, fT characteristics, and ring-oscillator large-signal characteristics over a broad speed range of power-switching currents. These were analyzed with and without capacitance loads. Corner file models formulated from this characterization in the design of circuits which were manufacturable and achieved correctness on first-pass design of a number of VLSI standard-cell ECL circuits
Keywords :
VLSI; bipolar integrated circuits; cellular arrays; emitter-coupled logic; integrated circuit technology; integrated logic circuits; semiconductor device models; ASPECT process; Advanced Single Poly Emitter Coupled Technology; VLSI; bipolar technologies; capacitance loads; capacitance voltage behavior; corner file models; design for manufacturability; emitter-coupled logic; empirical modeling methodology; fT; multipoint measurements; power-switching currents; right first time design; ring-oscillator large-signal characteristics; speed range; standard-cell ECL circuits; test chip; Circuit synthesis; Circuit testing; Coupling circuits; Databases; Integrated circuit manufacture; Integrated circuit technology; Logic design; Manufacturing processes; Very large scale integration; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location :
Rochester, NY
Type :
conf
DOI :
10.1109/CICC.1988.20861
Filename :
20861
Link To Document :
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