DocumentCode
3119979
Title
2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)
fYear
2004
fDate
4-6 May 2004
Abstract
The following topics were dealt with: defect free processing of thin wafers; semiconductor equipment productivity; advanced patterning and etching; yield enhancement methodologies and data management for semiconductor manufacturing; fab dynamics, material handling and fab layout; mask and fab control; advanced metrology and defect management for semiconductor equipment; MEMS; wide band semiconductor production; yield enhancement case studies.
Keywords
etching; integrated circuit economics; integrated circuit yield; masks; semiconductor technology; wide band gap semiconductors; advanced metrology; advanced semiconductor manufacturing; data management; defect free processing; defect management; etching; fab control; fab dynamics; fab layout; mask; material handling; patterning; semiconductor equipment productivity; thin wafers; wide band semiconductor; yield enhancement methodologies;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309515
Filename
1309515
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