DocumentCode :
3120080
Title :
Magnetic Microactuators for MEMS-Enabled Ventricular Catheters for Hydrocephalus
Author :
Lee, Selene A. ; Vasquez, Daniel J. ; Bergsneider, Marvin ; Judy, Jack W.
Author_Institution :
NeuroEng. Training Program, California Univ., Los Angeles, CA
fYear :
2006
fDate :
Aug. 30 2006-Sept. 3 2006
Firstpage :
2494
Lastpage :
2497
Abstract :
The most common treatment for patients with hydrocephalus is the surgical implantation of a cerebrospinal fluid (CSF) shunt. Unfortunately, this device, which is critical for lowering intracranial pressure, has a substantial failure rate (40% in the first year). A leading cause of failure is the obstruction of the ventricular catheter. The goal of this project is to design a ventricular catheter that will resist occlusion through the use of micromachining and micro electro-mechanical systems (MEMS) technologies. We designed, fabricated, and tested magnetic microactuators. The theoretical results show that the fabricated microactuators can produce the force necessary to remove an adherent cellular layer grown over the actuator surface. By integrating the microactuators into the catheters, we hope to produce an improved catheter with the ability to actively combat the health-threatening occlusion process
Keywords :
biological fluid dynamics; brain; catheters; microactuators; micromachining; micromechanical devices; neurophysiology; paediatrics; patient treatment; MEMS-enabled ventricular catheter; adherent cellular layer; cerebrospinal fluid shunt; health-threatening occlusion process; hydrocephalus; intracranial pressure; magnetic microactuator; micro electromechanical systems; micromachining; patient treatment; substantial failure rate; surgical implantation; Catheters; Cranial pressure; Medical treatment; Microactuators; Micromachining; Micromagnetics; Micromechanical devices; Resists; Surgery; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
ISSN :
1557-170X
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2006.259879
Filename :
4462301
Link To Document :
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