Title :
The surface morphology and bonding properties of free standing PMMA/TiO2 nanocomposite films
Author :
Hafizah, N.N. ; Ismail, L.N. ; Musa, M.Z. ; Mamat, M.H. ; Rusop, M.
Author_Institution :
NANO-SciTech Centre (NST), Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
Abstract :
PMMA/TiO2 nanocomposite films in free standing form were prepared at different amount of TiO2 nanoparticles by using sonication method. The PMMA powder and TiO2 nanopowder were dissolved into the toluene solution and sonicated for 1 h to confirm the homogeneity of the mixture. The FESEM micrographs reveal that PMMA/TiO2 nanocomposite contain 4 wt% TiO2 nanoparticles can produced the homogenous mixture with only little crack observed in the sample compared to other samples. Even the agglomerations were observed in other samples, all the TiO2 nanoparticles were fully dispersed in the PMMA matrix. The EDX results reveal the existence of the titanium and oxygen element in the nanocomposite films and FTIR results reveal the bonding properties between these two materials. Raman spectra of the PMMA/TiO2 nanocomposite films also were discussed in this paper.
Keywords :
Fourier transform spectra; Raman spectra; X-ray chemical analysis; bonding processes; field emission electron microscopy; filled polymers; infrared spectra; nanocomposites; nanofabrication; nanoparticles; particle reinforced composites; scanning electron microscopy; surface morphology; thin films; titanium compounds; EDX; FESEM micrographs; FTIR; Fourier transform infrared spectroscopy; PMMA matrix; Raman spectra; TiO2; agglomerations; bonding properties; energy dispersive X-ray analysis; field emission scanning electron microscopy; free standing nanocomposite films; nanoparticles; nanopowder; poly (methyl methacrylate); sonication; surface morphology; time 1 h; toluene solution; Chemicals; Films; Nanoparticles; Polymers; Surface morphology; Thermal stability; PMMA/TiO2 nanocomposites; bonding; free standing films; morphology;
Conference_Titel :
Business, Engineering and Industrial Applications (ISBEIA), 2012 IEEE Symposium on
Conference_Location :
Bandung
Print_ISBN :
978-1-4577-1632-4
DOI :
10.1109/ISBEIA.2012.6422982