• DocumentCode
    3120186
  • Title

    Reliability evaluation of direct chip attached silicon carbide pressure transducers

  • Author

    Okojie, Robert S. ; Savrun, Ender ; Nguyen, Phong ; Nguyen, Vu ; Blaha, Charles

  • Author_Institution
    NASA Glenn Res. Center, Cleveland, OH, USA
  • fYear
    2004
  • fDate
    24-27 Oct. 2004
  • Firstpage
    635
  • Abstract
    An accelerated stress test (AST) protocol has been developed and used to evaluate the reliability of 6H-silicon carbide (SiC) pressure transducers for operation up to 400 °C for 100 hours. After several cyclic excursions to 400 °C, the maximum drift of the zero pressure offset voltage at 25 °C was 1.9 mV, while the maximum drift at 400 °C was 2.0 mV. The full-scale sensitivity to pressure before and after the AST was 36.6 μV/V/psi at 25 °C and 20.5 μV/V/psi at 400 °C, with a maximum drift of ±1 μV/V/psi. No systematic degradation of the zero pressure offset was observed.
  • Keywords
    life testing; pressure transducers; semiconductor device reliability; sensitivity; silicon compounds; temperature; 100 hour; 25 to 400 C; SiC; accelerated stress test protocol; direct chip attached silicon carbide pressure transducers; reliability evaluation; semiconductor sensors; sensitivity; zero pressure offset voltage drift; Degradation; Diffusion bonding; Glass; Protocols; Semiconductor device packaging; Silicon carbide; Temperature sensors; Testing; Thermal stresses; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2004. Proceedings of IEEE
  • Print_ISBN
    0-7803-8692-2
  • Type

    conf

  • DOI
    10.1109/ICSENS.2004.1426246
  • Filename
    1426246