Title :
The development of lead-free printed circuit assembly technology in Hewlett-Packard: our strategy and experience
Author :
Henshall, Gregory A. ; Lindsley, Lisa W.
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
In this paper, we first describe the technical feasibility of candidate lead-free printed circuit assemblies (PCA) solutions. This discussion focuses on the two major classes of lead-free solders: high temperature, with alloy melting temperatures above that of conventional 63Sn-37Pb, and low temperature, with alloy melting temperatures below that of 63Sn-37Pb. Next, we review HP´s goals for producing lead-free products and strategies for meeting these goals. We then present the current status of our investigations, and finally our key technical and business learnings and recommendations
Keywords :
printed circuit manufacture; soldering; Hewlett-Packard; business learnings; high temperature; lead-free printed circuit assembly technology; lead-free products; lead-free solders; Assembly; Consumer electronics; Costs; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Principal component analysis; Printed circuits; Temperature;
Conference_Titel :
Electronics and the Environment, 2001. Proceedings of the 2001 IEEE International Symposium on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-6655-7
DOI :
10.1109/ISEE.2001.924543
