Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors

This paper presents the development of two new types of optical sensors that can measure both pressure and shear stresses in an unobtrusive way. Standard packaging technologies for optoelectronic components result in very bulky and rigid sensors. We present an optoelectronic package which is flexible, only 40 μm thick and which can be bent down to a bending radius of 2 mm. This advanced packaging technique enables the flexibility and compactness of the sensors, which are needed to be unobtrusive. The resulting pressure and shear sensors are discussed, characterized and demonstrated.