• DocumentCode
    3120776
  • Title

    Ion implant process monitoring with a dynamic surface photo-charge technique

  • Author

    Tsidilkovski, Edward ; Crocker, Kendra ; Steeples, Kenneth

  • Author_Institution
    QC Solutions Inc, North Billerica, MA, USA
  • fYear
    2004
  • fDate
    4-6 May 2004
  • Firstpage
    181
  • Lastpage
    186
  • Abstract
    A detailed parametric study was carried out over the course of approximately one year to determine the measurement sensitivity and repeatability of an in-line surface photo-charge metrology system for major implant parameters used in an established, high volume, 0.35 μm CMOS process. The critical p-channel transistor implant processes; Threshold Voltage Adjust and Halo were used to characterize the metrology system. Dose variations as small as 1.5% have been measured with statistical accuracy, enabling improvements in process control to be quantified in real time. Long-term system repeatability of less than 1% (1σ) for a wide variety of implants has allowed the sensitive visibility of process drift or spike excursions to be highlighted in real-time.
  • Keywords
    CMOS integrated circuits; arsenic; boron; ion implantation; process monitoring; surface photovoltage; As; B; CMOS process; drift excursions; dynamic surface photocharge technique; ion implant process monitoring; metrology system; p channel transistor; sensitive visibility; spike excursion; system repeatability; Circuit testing; Corona; Implants; Ion implantation; Measurement techniques; Monitoring; Real time systems; Semiconductor materials; Silicon; Volume measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
  • Print_ISBN
    0-7803-8312-5
  • Type

    conf

  • DOI
    10.1109/ASMC.2004.1309562
  • Filename
    1309562