Title :
Application of advanced macro defect inspection technology for MEMS processes
Author :
Grosjean, D.E. ; Elwell, R.H. ; Keller, J.L. ; Clay, M.
Author_Institution :
Micromachined Products Div., Analog Devices Inc., Cambridge, MA, USA
Abstract :
We describe the application of the August NSX-105 macro defect inspection tool in finding a defect that caused yield loss in the sensor portion of ADI´s surface micromachining process for accelerometers. The source of the defect actually causes defects in both the circuit and sensor areas of the die, but due to the different processing that each location sees, the appearances were very different. Our work to improve yield in the sensor portion of the process thus improved the circuit portion of the process as well.
Keywords :
accelerometers; etching; inspection; micromachining; microsensors; MEMS processes; accelerometers; macrodefect inspection technology; sensor; surface micromachining; yield loss; Acceleration; Accelerometers; BiCMOS integrated circuits; Capacitive sensors; Fabrication; Fingers; Inspection; Manufacturing; Micromachining; Micromechanical devices;
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
DOI :
10.1109/ASMC.2004.1309598
