DocumentCode
3121799
Title
The Smartpack(R), a low cost high performance solution for power packaging
Author
Masana, F.N. ; Hinchley, D.A. ; Rahimo, M.T. ; Jones, S.R.
Author_Institution
Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
fYear
1999
fDate
1999
Firstpage
42675
Lastpage
42680
Abstract
In this paper, Semelab introduces the Smartpack(R) novel semi-custom plastic power module. The Smartpack represents a breakthrough in the low cost packaging of semiconductor dies, and is suitable for almost any power electronic application, regardless of complexity. This paper details Smartpack´s construction and demonstrates the module´s thermal efficiency, electrical performance and reliability
Keywords
power integrated circuits; Smartpack(R); construction; electrical performance; electrical reliability; low cost packaging; power electronic applications; semi-custom plastic power module; semiconductor dies; thermal efficiency;
fLanguage
English
Publisher
iet
Conference_Titel
Recent Advances in Power Devices (Ref. No. 1999/104), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19990601
Filename
789951
Link To Document