DocumentCode :
3121841
Title :
Modeling intrinsic and extrinsic asymmetry of 3D cylindrical gate/gate-all-around FETs for circuit simulations
Author :
Venugopalan, S. ; Chauhan, Y.S. ; Lu, D.D. ; Karim, M.A. ; Niknejad, Ali M. ; Hu, Chenming
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, Berkeley, CA, USA
fYear :
2011
fDate :
7-9 Nov. 2011
Firstpage :
1
Lastpage :
4
Abstract :
In a vertical cylindrical gate transistor, we identify doping gradation along channel and structural difference in electrode regions as major reasons for highly asymmetric drain current characteristics. These effects have been captured in a physical manner in a SPICE model. Calibration results of such a model to silicon device data from a vertical cylindrical gate technology that exhibits asymmetric I-V characteristics is presented for the first time.
Keywords :
SPICE; circuit simulation; electrodes; field effect transistors; semiconductor doping; 3D cylindrical gate; SPICE model; asymmetric I-V characteristic; circuit simulation; doping gradation; drain current characteristic; electrode region; extrinsic asymmetry; gate-all-around FET; intrinsic asymmetry; silicon device data; vertical cylindrical gate transistor; Doping; FETs; Integrated circuit modeling; Junctions; Logic gates; Semiconductor process modeling; Asymmetric Transistor Modeling; BSIM SPICE Compact Model; Vertical Cylindrical/Surround Gate Transistor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Non-Volatile Memory Technology Symposium (NVMTS), 2011 11th Annual
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1428-3
Type :
conf
DOI :
10.1109/NVMTS.2011.6137100
Filename :
6137100
Link To Document :
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