Title : 
Preliminary Study of the Thermal Impact of a Microelectrode Array Implanted in the Brain
         
        
            Author : 
Kim, Sohee ; Normann, Richard A. ; Harrison, Reid ; Solzbacher, Florian
         
        
            Author_Institution : 
Dept. of Electr. & Comput. Sci., Utah Univ., Salt Lake City, UT
         
        
        
            fDate : 
Aug. 30 2006-Sept. 3 2006
         
        
        
        
            Abstract : 
One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah electrode array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments
         
        
            Keywords : 
arrays; bioelectric phenomena; biomedical electrodes; biomedical electronics; biomedical measurement; biothermics; finite element analysis; integrated circuits; microelectrodes; neurophysiology; physiological models; FEM model; brain tissues temperature; electronic IC; electronic circuitry; finite element method; in vitro experiments; integrated 3-dimensional Utah electrode array; microelectrode array implantation; neural recording; thermal impact; wireless neural interface device; Brain modeling; Circuits; Cities and towns; Electrodes; Finite element methods; Heat transfer; Implants; Microelectrodes; Temperature; USA Councils;
         
        
        
        
            Conference_Titel : 
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
         
        
            Conference_Location : 
New York, NY
         
        
        
            Print_ISBN : 
1-4244-0032-5
         
        
            Electronic_ISBN : 
1557-170X
         
        
        
            DOI : 
10.1109/IEMBS.2006.260307