DocumentCode
3123218
Title
Modeling conjugate heat transfer
Author
Sabry, Mohamed-Nabil
Author_Institution
Mansoura University, Egypt
fYear
2010
fDate
19-22 Dec. 2010
Firstpage
7
Lastpage
7
Abstract
Modeling conduction heat transfer in electronic systems has gained some maturity over the past 3 decades. Although new modeling challenges were associated with 3D stacked dies or packages, some modeling approaches were proposed to handle this rather complicated multiple heat source problem. An even newer problem has started to emerge related to this growing tendency towards exploiting the vertical direction. In fact cooling becomes more and more 3D also, in the sense intermediate micro-channels are proposed going between dies and or packages. This brings convection into play aside with convection in an intimate coupling, commonly called conjugate heat transfer. It is no longer possible to treat convection as an “external” phenomenon, to be modeled by a simple external resistance. In this lecture, fundamental aspects about conjugate heat transfer are revised to obtain a realistic model that avoids large errors that could have been encountered had we treated conduction and convection separately. Fundamental concepts are revised, going up to the notion of heat transfer coefficient in order to elaborate a better model of forced convection in its most general form. The new modeling strategy will build upon progress already realized in Compact Thermal Models (CTM) for conduction in complicated electronic systems. Advanced conduction CTM will be generalized to include convection as well. This will allow a better modeling of convection, but more important a homogeneous and coherent modeling of conjugate heat transfer. Cooling of electronic systems is continuously raising new challenges not only for innovative solutions, but also for modeling of new atypical cases. The higher frequency we ask for, the greater number of functionalities we require as well, both tend to increase heat flux densities to unprecedented levels in industrial applications. Densities higher than those of a nuclear reactor were already realized in electronic systems. We are heading towa- ds densities of rocket nozzle. Complexity related to these high heat fluxes has many origins that will be addressed, in order to motivate subsequent discussions. A summary of recent advances in conduction modeling will be given before generalizing them to convection. Conjugate convection will be studied.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on
Conference_Location
Cairo
Print_ISBN
978-1-61284-268-4
Type
conf
DOI
10.1109/THETA.2010.5766373
Filename
5766373
Link To Document