• DocumentCode
    3123323
  • Title

    Copper micro-channel thermosyphon fins for heat sink application

  • Author

    Alam, Khairul ; Flores, Juan ; Urieli, I.

  • Author_Institution
    Ohio Univ., Athens, OH, USA
  • fYear
    2010
  • fDate
    19-22 Dec. 2010
  • Firstpage
    43
  • Lastpage
    49
  • Abstract
    Fins are commonly used to increase surface area for enhancing heat transfer to the ambient air or other coolants. The finite thermal conductivity of the fin material is a limiting factor in the heat transfer because of the thermal resistance and temperature drop across the length of the fins. The ideal system should have fins of very high thermal conductivity, resulting in isothermal fins and 100% fin efficiency. To take advantage of the very high apparent conductivity of thermosyphons, a loop thermosyphon system has been designed to keep a set of fins close to isothermal conditions. In the experimental system, the condenser of the thermosyphon loop was embedded within copper fins in a set of micro-channel tubes, with propane as the working fluid. Experimental results showed that this integrated arrangement of thermosyphon and fins results in reasonably isothermal fins, producing high fin efficiency. The specific volume of the working fluid was determined and used to characterize the system performance and stability.
  • Keywords
    coolants; heat pipes; heat sinks; heat transfer; ambient air; coolants; copper micro-channel thermosyphon fins; finite thermal conductivity; heat sink application; heat transfer; Copper; Electron tubes; Fluids; Heat sinks; Heat transfer; Heating; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    978-1-61284-268-4
  • Type

    conf

  • DOI
    10.1109/THETA.2010.5766378
  • Filename
    5766378