Title :
CPU thermal management of personal and notebook computer (Transient study)
Author :
Abbas, T. ; Abd-elsalam, K.M. ; Khodairy, KH
Author_Institution :
Higher Technol. Inst., Tenth of Ramadan City, Egypt
Abstract :
Heat generated by electronic devices and circuit must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as liquid cooling. Computer cooling is the process of removing heat from computer components. Because a computer system´s components produce large amounts of heat during operation, this heat must be dissipated in order to keep these components within their safe operating temperatures. In addition to maintaining normative function, Components which produce heat and are susceptible to performance loss and damage include integrated circuits such as CPUs, chipset and graphics cards, along with hard drives (though excessive cooling of hard drives has been found to have negative effects). Overheated parts generally exhibit a shorter maximum life-span and may give sporadic problems resulting in system freezes or crashes. Both integral (manufacturing) and peripheral means (additional parts) are used to keep the heat of each component at a safe operational level. With regard to integral means, CPU and GPUs are designed entirely with energy efficiency, including heat dissipation, in mind, and with each advance CPUs/GPUs generally produce less heat (though this increased efficiency is always used to increase performance, producing similar heat levels as earlier models anyway). Cooling through peripheral means is mainly done using heat sinks to increase the surface area which dissipates heat, fans to speed up the exchange of air heated by the computer parts for cooler ambient air, and in some cases soft cooling. Comparisons between traditional methods of CPU cooling, and new fashions of cooling (like Heat pipes, and Thermoelectric cooling) have been performed. Moreover, Thermal affects on processor performance, has been studied. Effect of time on heat transfer and processor temperature enhancement has been studied.
Keywords :
cooling; coprocessors; disc drives; electronic engineering computing; fans; hard discs; heat pipes; heat sinks; integrated circuit reliability; microcomputers; notebook computers; system recovery; thermal management (packaging); CPU cooling; CPU thermal management; GPU; air cooling; chipset; computer components; computer cooling; computer system components; cooler ambient air; electronic circuit; electronic devices; energy efficiency; fans; graphics cards; hard drives; heat dissipation; heat generation; heat pipes; heat sinks; heat transfer; integral cooling; integrated circuits; liquid cooling; normative function; notebook computer; overheated parts; performance loss; peripheral cooling; personal computer; premature failure; processor performance; processor temperature enhancement; reliability; safe operating temperatures; safe operational level; soft cooling; system crashes; system freezes; thermal affects; thermoelectric cooling; Central Processing Unit; Computers; Heat sinks; Heat transfer; Resistance heating;
Conference_Titel :
Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on
Conference_Location :
Cairo
Print_ISBN :
978-1-61284-268-4
DOI :
10.1109/THETA.2010.5766383