• DocumentCode
    3123723
  • Title

    A model-based MICOM application software development method

  • Author

    Kang, Kyo C. ; Jang, Sey-Chan

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., South Korea
  • fYear
    1994
  • fDate
    7-9 Dec 1994
  • Firstpage
    124
  • Lastpage
    132
  • Abstract
    Most electronics products have an embedded MICOM (MIcro COMputer) in which a control program runs. These programs, called microprograms, have usually been developed by electronics engineers in an ad hoc way. Severe competition among electronics companies, however, has forced them to adopt a systematic, engineering method. A model-based software engineering approach is developed in this paper to improve the process of MICOM software development. This approach consists of two major phases: the model development phase and the model-based applications development phase. The model development phase focuses on the development of a domain model for the MICOM applications domain and use of the domain model to develop models for product families (e.g. TV, microwave oven). Product family models are used in the model-based development phase to analyze requirements and design software for specific products in the same family. The TV application family was used to illustrate this approach
  • Keywords
    microprogramming; software reusability; MICOM; MICOM software development; TV application family; application software development method; control program; domain model; electronics companies; electronics engineers; embedded MICOM; microprograms; model-based applications development; model-based development phase; model-based software engineering; product families; requirements analysis; Application software; Assembly; Computer science; Consumer electronics; Embedded computing; Microwave ovens; Programming; Software design; Software engineering; TV;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Software Engineering Conference, 1994. Proceedings., 1994 First Asia-Pacific
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-8186-6960-8
  • Type

    conf

  • DOI
    10.1109/APSEC.1994.465267
  • Filename
    465267