Title :
CMOS APS crosstalk: modeling, technology and design trends
Author :
Shcherback, I. ; Belenky, Alexander ; Yadid-Pecht, O.
Author_Institution :
VLSI Syst. Center, Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
Abstract :
In this work based on a unique sub-micron scanning system (S-cube system) measurements of the lateral photoresponse and crosstalk (CTK) in CMOS active pixel sensor (APS) have been investigated and an analytical model was developed for crosstalk estimation in photodiode based CMOS APS arrays. Based on handy process and design data only, our model estimates the CTK contribution to the readout pixel from each particular neighbor. It reveals the photosignal and the CTK dependence on the pixel´s geometrical shape (the photodiode active area and perimeter) and the pixel arrangement within the array and brings out clearly the possibility of a design enabling minimum and symmetrical CTK, and thus can be used as a predictive tool for design optimization. The trends that promise to increase CMOS image sensor performance are presented and design tradeoffs intended to optimize the photoresponse and minimize crosstalk are discussed.
Keywords :
CMOS image sensors; circuit optimisation; crosstalk; integrated circuit design; integrated circuit measurement; integrated circuit modelling; parameter estimation; photodiodes; APS technology; CMOS APS crosstalk; CMOS active pixel sensor; CMOS image sensor performance; CTK; S-cube system measurements; analytical model; crosstalk estimation; design data; design tradeoffs; design trends; minimum symmetrical CTK design; modeling; parameter estimation; photodiode active area; photodiode based CMOS APS arrays; photodiode perimeter; photoresponse; photosignal dependence; pixel geometrical shape; predictive design optimization tool; process data; readout pixel; scanning system; Analytical models; CMOS image sensors; CMOS technology; Crosstalk; Design optimization; Photodiodes; Process design; Semiconductor device modeling; Sensor arrays; Sensor systems;
Conference_Titel :
Sensors, 2004. Proceedings of IEEE
Print_ISBN :
0-7803-8692-2
DOI :
10.1109/ICSENS.2004.1426410
