• DocumentCode
    3124382
  • Title

    Thermal considerations on highly integrated module for small power drives

  • Author

    Frank, W. ; Chung, D. ; Lee, J. ; Song, J.

  • Author_Institution
    Infineon Technol. Germany, Germany
  • fYear
    2010
  • fDate
    4-7 July 2010
  • Firstpage
    3840
  • Lastpage
    3844
  • Abstract
    High integration of power electronic systems require optimised packages. This paper presents an innovative, fully-molded intelligent power module for small power three phase drives in a dual-in-line package. The package itself offers the possibility of integrating additionally the input bridge rectifier. The paper discusses the thermal performance of the module concept by working out the impact of the rectifier loses in respect of case temperatures. The overall losses balance is calculated and the result is compared with measurements while operating the module with and without input rectifier.
  • Keywords
    electronics packaging; power electronics; rectifiers; dual-in-line package; highly integrated module; input bridge rectifier; power electronic systems; small power drives; thermal considerations; Heat sinks; Insulated gate bipolar transistors; Inverters; Multichip modules; Rectifiers; Semiconductor device measurement; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics (ISIE), 2010 IEEE International Symposium on
  • Conference_Location
    Bari
  • Print_ISBN
    978-1-4244-6390-9
  • Type

    conf

  • DOI
    10.1109/ISIE.2010.5637741
  • Filename
    5637741