• DocumentCode
    3124410
  • Title

    Temperature effects on on-chip energy measurements

  • Author

    Cebrian, Juan M. ; Natvig, Lasse

  • Author_Institution
    Dept. of Comput. & Inf. Sci. (IDI), NTNU Trondheim, Trondheim, Norway
  • fYear
    2013
  • fDate
    27-29 June 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Latest generations of microprocessors target to maximize energy efficiency over other constraints such as area or performance. This turn of events does not only affect the industry, the academia is also focusing it´s efforts in proposing new solutions to maximize energy efficiency of computations at all levels, from hardware to software. While voltage, frequency and activity factors are usually considered by researchers in their works, temperature is usually left aside in their calculations or models. In this work we present an evaluation of the effects of temperature in real hardware taking advantage of the relatively new hardware energy counters available since the second generation of Intel® Core™ processors. Results show an average 5% energy increase with every 8-10 degrees Celsius increment. After certaint temperature (80-100C), the processor starts throttling it´s frequency to prevent permanent damage on the die. Based on these results we will discuss some “good practices” when evaluating power and energy based on on-chip energy measurements.
  • Keywords
    energy conservation; microprocessor chips; power aware computing; Intel Core processors; energy efficiency; hardware energy counters; microprocessors; on-chip energy measurements; temperature 80 degC to 100 degC; temperature effects; Benchmark testing; Energy measurement; Power dissipation; Program processors; Temperature; Temperature measurement; Transistors; Energy Efficiency; Energy Measurement; MSRs; RAPL; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Green Computing Conference (IGCC), 2013 International
  • Conference_Location
    Arlington, VA
  • Type

    conf

  • DOI
    10.1109/IGCC.2013.6604484
  • Filename
    6604484