DocumentCode
3124534
Title
Analysis of plasma damage on phase change memory cells
Author
Pellizzer, F. ; Spandre, A. ; Alba, S. ; Pirovano, A.
Author_Institution
Central R&D, STMicroelectronics, Agrate Brianza, Italy
fYear
2004
fDate
2004
Firstpage
227
Lastpage
230
Abstract
Phase change memories based on chalcogenide materials are being studied as an alternative for nonvolatile information storage, because they can become attractive for technology nodes beyond 65 nm due to their intrinsic scalability In this paper we propose a first analysis of plasma damage of phase memory cells, starting from the basic electrical characteristics of storage elements and then including the effects of different selecting devices. Taking into account the architecture of phase change arrays, we will evaluate typical etching conditions and try to understand any possible impact on cell parameters and performances. Finally we will show some electrical results on real devices, integrated in a standard CMOS process in 0.18 μm technology.
Keywords
CMOS memory circuits; chalcogenide glasses; plasma materials processing; sputter etching; BJT selector; I-V characteristic; basic electrical characteristics; cell parameters; cell performances; chalcogenide materials; etching conditions; n-MOSFET selector; nonvolatile storage; phase change array architecture; phase change memory cells; plasma damage; standard CMOS process; Information analysis; Material storage; Nonvolatile memory; Phase change materials; Phase change memory; Phased arrays; Plasma applications; Plasma materials processing; Plasma properties; Scalability;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN
0-7803-8528-4
Type
conf
DOI
10.1109/ICICDT.2004.1309950
Filename
1309950
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