DocumentCode :
3124646
Title :
Advanced germanium MOSFET technologies with high-κ gate dielectrics and shallow junctions
Author :
Chui, Chi On ; Saraswat, Krishna C.
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., CA, USA
fYear :
2004
fDate :
2004
Firstpage :
245
Lastpage :
252
Abstract :
Various advanced germanium (Ge) metal-oxide-semiconductor field-effect transistor (MOSFET) technologies with high-permittivity (high-κ) gate dielectrics and shallow junctions have been demonstrated. Numerous novel Ge technologies on surface cleaning, gate dielectric, and dopant incorporation are presented In addition, we disclose an innovative self-aligned gate-last fabrication process not only to demonstrate functional Ge MOSFETs, but also to provide a vehicle to characterize many novel material integration schemes.
Keywords :
MOSFET; elemental semiconductors; germanium; nanoelectronics; nitridation; rapid thermal annealing; semiconductor doping; thermal stability; Ge; advanced germanium MOSFET technologies; dopant incorporation; functional MOSFET; high mobility material; high-permittivity gate dielectrics; material integration schemes; nanoscale dielectrics; rapid thermal nitridation; self-aligned gate-last fabrication; shallow junctions; surface cleaning; thermal anneal budget; thermal stability; Dielectric devices; Dielectric materials; Germanium; MOSFET circuits; Monte Carlo methods; Nanoscale devices; Optical scattering; Photonic band gap; Threshold voltage; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN :
0-7803-8528-4
Type :
conf
DOI :
10.1109/ICICDT.2004.1309955
Filename :
1309955
Link To Document :
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