DocumentCode
3124765
Title
Strained silicon: engineered substrates and device integration
Author
Currie, Matthew T.
Author_Institution
ArnberWave Syst. Corp., Salem, NH, USA
fYear
2004
fDate
2004
Firstpage
261
Lastpage
268
Abstract
Strained Si is emerging as a technology vital to the continued progression of transistor performance laid out in the International Technology Roadmap for Semiconductors. Strained Si fundamentals are reviewed, as is the structure of optimized strained Si substrates. Substrate fabrication guidelines that emphasize material quality and economic processing are discussed. The impact of the substrate structure on strained Si device performance and integration is described. Strained-Si-on-Insulator, an advanced structure derived from strained Si substrates, is also introduced.
Keywords
MOSFET; chemical vapour deposition; dislocation density; elemental semiconductors; semiconductor epitaxial layers; silicon; silicon-on-insulator; substrates; surface roughness; vapour phase epitaxial growth; MOSFET; Si; advanced CMOS devices; chemical vapor deposition; device integration; device performance; economic processing; engineered substrates; epitaxial wafers; fabrication guidelines; material quality; misfit dislocations; optimized substrates; strained silicon; strained-Si-on-insulator; surface roughness; threading dislocations; transistor performance; virtual substrate; Anisotropic magnetoresistance; Capacitive sensors; Electron mobility; Germanium silicon alloys; Lattices; Light scattering; MOSFET circuits; Silicon germanium; Substrates; Tensile strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN
0-7803-8528-4
Type
conf
DOI
10.1109/ICICDT.2004.1309959
Filename
1309959
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