• DocumentCode
    3124765
  • Title

    Strained silicon: engineered substrates and device integration

  • Author

    Currie, Matthew T.

  • Author_Institution
    ArnberWave Syst. Corp., Salem, NH, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    261
  • Lastpage
    268
  • Abstract
    Strained Si is emerging as a technology vital to the continued progression of transistor performance laid out in the International Technology Roadmap for Semiconductors. Strained Si fundamentals are reviewed, as is the structure of optimized strained Si substrates. Substrate fabrication guidelines that emphasize material quality and economic processing are discussed. The impact of the substrate structure on strained Si device performance and integration is described. Strained-Si-on-Insulator, an advanced structure derived from strained Si substrates, is also introduced.
  • Keywords
    MOSFET; chemical vapour deposition; dislocation density; elemental semiconductors; semiconductor epitaxial layers; silicon; silicon-on-insulator; substrates; surface roughness; vapour phase epitaxial growth; MOSFET; Si; advanced CMOS devices; chemical vapor deposition; device integration; device performance; economic processing; engineered substrates; epitaxial wafers; fabrication guidelines; material quality; misfit dislocations; optimized substrates; strained silicon; strained-Si-on-insulator; surface roughness; threading dislocations; transistor performance; virtual substrate; Anisotropic magnetoresistance; Capacitive sensors; Electron mobility; Germanium silicon alloys; Lattices; Light scattering; MOSFET circuits; Silicon germanium; Substrates; Tensile strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
  • Print_ISBN
    0-7803-8528-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2004.1309959
  • Filename
    1309959