Title :
New technology for high throughput THz BioMEMS
Author :
Mille, V. ; Bourzgui, N.-E. ; Vivien, C. ; Supiot, P. ; Bocquet, B.
Author_Institution :
Microsyst. Microfluidics & Thz Group, Lille Univ., Villeneuve d´´Ascq
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
We propose a new technology for high throughput bioMEMS based on a mixed technology polymer on silicon. This technology is compatible with microelectronic processes, the electromagnetic propagation, the microfluidic circulation and the biological solutions. We use a new process and a new polymer deposited by a "cold" plasma technique. We can use it for a surface functionalization or for the encapsulation with plasma assisted wafer bonding
Keywords :
bioMEMS; biosensors; electromagnetic wave propagation; microfluidics; plasma materials processing; polymers; silicon; wafer bonding; biological solutions; biosensor; cold plasma technique; electromagnetic propagation; encapsulation; high throughput bioMEMS; microelectronic processes; microfluidic circulation; microsystems; microtechnology; mixed technology polymer; plasma assisted wafer bonding; polymer deposition; silicon; surface functionalization; terahertz bioMEMS; Biosensors; Microelectronics; Microfluidics; Optical surface waves; Plasma applications; Plasma chemistry; Plasma materials processing; Polymers; Silicon; Throughput; BioMEMS; Biosensor; Microfluidic; Microsystems; Microtechnology; Plasma polymer; Terahertz;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.260289
