Title :
Silicon micro machined hermetic packaging technology for optical subassemblies
Author :
Kilian, Arnd ; Hauffe, Ralf ; Winter, Marcus ; Runge, Patrick ; Kuhmann, Jochen ; Greisen, Christoffer Graae ; Weichel, Steen ; Shiv, Lior ; Heschel, Matthias
Author_Institution :
Hymite GmbH, Berlin
Abstract :
A novel technology for building hermetic optical subassemblies based on silicon is presented which supports precision alignment features, integration of passives, outstanding RF-performance and waferscale assembly and testing. Examples of OSAs will be shown
Keywords :
micro-optomechanical devices; microassembling; micromachining; silicon; surface mount technology; wafer level packaging; SMD mountable package; Si; integrated BIAS feed; optical subassemblies; silicon micro machined hermetic packaging technology; waferscale assembly; waferscale testing; Assembly; Biomedical optical imaging; Electronic packaging thermal management; Optical control; Packaging machines; Silicon; Testing; Thermal conductivity; Tin; Wafer bonding;
Conference_Titel :
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-9555-7
Electronic_ISBN :
0-7803-9555-7
DOI :
10.1109/LEOS.2006.278876
