Title :
Energy dependence of vacuum-ultraviolet-induced radiation damage to electronic materials
Author :
Lauer, J.L. ; Shohet, J.L. ; Hansen, R.W. ; Bathke, R.D. ; Grierson, B. ; Upadhyaya, G. ; Kukkady, K. ; Kalwitz, J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Abstract :
Dielectric charging plays a key role in processing damage of semiconductor devices. VUV radiation with energies in the range of 4-30 eV can induce charge on electronic materials. Radiation charging of Si wafers coated with 3000A of Si3N4 from synchrotron VUV exposure with photon fluxes in the range of 109-1013 photons/sec cm-2 were measured with a Kelvin probe. The photoemission current and substrate voltage were monitored during each exposure. The integral of photoemission current was compared to the net charge measured with the Kelvin probe for VUV photon energies between 7-21 eV. The net charge induced on the dielectric results from both photoemission (which saturates for long exposure times) as well as from charge carriers generated within the dielectric. Since the threshold photon energy for photoemission is higher than that for electron-hole pair production, it is seen that photoemission can be minimized if the photon energies are below the threshold energy.
Keywords :
dielectric thin films; elemental semiconductors; photoemission; plasma materials processing; semiconductor technology; silicon; sputter etching; surface charging; surface potential; ultraviolet radiation effects; 4 to 30 eV; Si; dielectric charging; dielectric materials; electron-hole pair production; electronic materials; energy dependence; photoemission current; plasma processing; substrate voltage; synchrotron VUV exposure; threshold photon energy; vacuum-ultraviolet-induced radiation damage; Dielectric devices; Dielectric materials; Dielectric measurements; Dielectric substrates; Elementary particle vacuum; Kelvin; Photoelectricity; Probes; Semiconductor devices; Semiconductor materials;
Conference_Titel :
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN :
0-7803-8528-4
DOI :
10.1109/ICICDT.2004.1309972