Title :
Bio-Heat Transfer Model of Deep Brain Stimulation Induced Temperature changes
Author :
Elwassif, Maged M. ; Kong, Qingjun ; Vazquez, Maribel ; Bikson, Marom
Author_Institution :
Dept. of Biomed. Eng., City Coll. of New York, NY
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
There is a growing interest in the use of chronic deep brain stimulation (DBS) for the treatment of medically refractory movement disorders and other neurological and psychiatric conditions. Fundamental questions remain about the physiologic effects and safety of DBS. Previous basic research studies have focused on the direct polarization of neuronal membranes by electrical stimulation. The goal of this paper is to provide information on the thermal effects of DBS using finite element models to investigate the magnitude and spatial distribution of DBS induced temperature changes. The parameters investigated include: stimulation waveform, lead selection, brain tissue electrical and thermal conductivity, blood perfusion, metabolic heat generation during the stimulation. Our results show that clinical deep brain stimulation protocols will increase the temperature of surrounding tissue by up to 0.8degC depending on stimulation/tissue parameters
Keywords :
bioelectric phenomena; biothermics; brain; electrical conductivity; finite element analysis; haemorheology; neurophysiology; patient treatment; physiological models; temperature distribution; thermal conductivity; bio-heat transfer model; blood perfusion; brain tissue electrical conductivity; brain tissue thermal conductivity; chronic deep brain stimulation; finite element models; lead selection; medically refractory movement disorders; metabolic heat generation; neurological conditions; psychiatric conditions; stimulation waveform; temperature distribution; thermal effects; Biomembranes; Brain modeling; Brain stimulation; Medical treatment; Polarization; Psychology; Safety; Satellite broadcasting; Temperature; Thermal conductivity;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.259425