Title :
Prevention of Hot Spot Development on Coarse-Grained Dynamically Reconfigurable Architectures
Author :
Eisenhardt, Sven ; Schweizer, Thomas ; Bernauer, Andreas ; Kuhn, Tommy ; Rosenstiel, Wolfgang
Author_Institution :
Dept. of Comput. Eng., Univ. of Tubingen, Tubingen, Germany
Abstract :
With the increasing power density of deep submicron technology, temperature becomes one of the dominating factors for the reliability of integrated circuits. Coarse-grained reconfigurable devices typically exhibit spatially nonuniform activity, which results in areas of localized heating, so called hot spots. In this work we investigate the effects of continuous activity migration in order to prevent hot spots. By applying activity migration we are able to reduce temporal and spatial variations of temperature by up to 87%.
Keywords :
integrated circuit reliability; reconfigurable architectures; coarse-grained dynamically reconfigurable architectures; coarse-grained reconfigurable devices; deep submicron technology; hot spot development prevention; integrated circuit reliability; power density; Accelerated aging; Cooling; Heating; Integrated circuit reliability; Integrated circuit technology; Power dissipation; Power engineering computing; Reconfigurable architectures; Temperature; Thermal management; coarse-grained; hot spot; reconfigurable computing; reliability; temperature optimization;
Conference_Titel :
Reconfigurable Computing and FPGAs, 2009. ReConFig '09. International Conference on
Conference_Location :
Quintana Roo
Print_ISBN :
978-1-4244-5293-4
Electronic_ISBN :
978-0-7695-3917-1
DOI :
10.1109/ReConFig.2009.18
