Title :
Skin Penetration of Silicon Dioxide Microneedle Arrays
Author :
Kim, Sangchae ; Shetty, Smitha ; Price, Dorielle ; Bhansali, Shekhar
Author_Institution :
Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
Out-of-plane hollow silicon dioxide microneedle arrays were fabricated and investigated to determine their efficacy for transdermal applications. The fabrication process of the SiO2 microneedles is described, and mechanical fracture forces were investigated on microneedles with different geometrical dimensions. Biomechanical characterization of the microneedles was performed to specifically test for reliable stratum corneum and skin insertion by changing the regulatory parameters such as needle width and cross-section
Keywords :
bioMEMS; biomechanics; fracture; needles; silicon compounds; skin; MEMS; SiO2; biomechanical characterization; fabrication process; geometrical dimensions; mechanical fracture forces; needle cross-section; needle width; regulatory parameters; silicon dioxide microneedle arrays; skin insertion; skin penetration; stratum corneum; transdermal applications; Cities and towns; Drugs; Fabrication; Force measurement; Needles; Silicon compounds; Skin; Testing; USA Councils; Wet etching; MEMS; Microneedle; Skin; Stratum Corneum;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.260142
