• DocumentCode
    3128330
  • Title

    Power module technology for the 21st century

  • Author

    Smith, Carl Fa

  • Author_Institution
    Div. of Electron. & Syst. Integration, Northrup Grumman Corp., USA
  • Volume
    1
  • fYear
    1995
  • fDate
    22-26 May 1995
  • Firstpage
    106
  • Abstract
    Power modules are highly miniaturized and fully integrated amplifiers (transmitters) operating in the microwave and millimeter wave frequency bands. Three traditionally dissimilar components, a traveling wave tube (TWT), power supply, and solid-state amplifier are integrated into one package to form the power module “supercomponent”. Depending on design requirements, the power modules deliver nominally 100 watts of continuous wave (CW) radio frequency (RF) output power with greater than 50 dB gain over bandwidths reaching 1.5 octaves. Various Microwave Power Modules (MPMs) have demonstrated unsurpassed efficiencies and previously unattainable noise performance for the required gain and output power levels. When compared to fielded military electronic systems, MPMs are one-tenth the volume and one-sixth the weight with 2.5 times the RF output power and 5 times the efficiency. MMIC and ASIC devices have been incorporated within the power modules to support the next generation high performance electronics requirements. A family of power modules is being developed from 2 to 40 GHz. This family of power modules can be used to support breadboard transmitter requirements for electronic countermeasures, radar, communications, phased arrays, and advanced material processing applications
  • Keywords
    MMIC power amplifiers; aircraft; application specific integrated circuits; avionics; integrated circuit packaging; integrated circuit reliability; military avionics; military equipment; millimetre wave power amplifiers; modules; power convertors; power supplies to apparatus; power supply circuits; radio transmitters; reliability; travelling wave tubes; 2 to 40 GHz; 50 dB; ASIC; MMIC; breadboard transmitter requirements; communications; electronic countermeasures; fully integrated amplifiers; high reliability; highly miniaturized; microwave frequency; military electronics; millimeter wave frequency; next generation high performance electronics; noise performance; packaging; phased arrays; power conditioner; power module technology; power supply; radar; solid-state amplifier; supercomponent; traveling wave tube; vacuum electronics; High power amplifiers; Microwave amplifiers; Millimeter wave radar; Millimeter wave technology; Multichip modules; Phased arrays; Power amplifiers; Power generation; Radio frequency; Radio transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1995. NAECON 1995., Proceedings of the IEEE 1995 National
  • Conference_Location
    Dayton, OH
  • ISSN
    0547-3578
  • Print_ISBN
    0-7803-2666-0
  • Type

    conf

  • DOI
    10.1109/NAECON.1995.521920
  • Filename
    521920