• DocumentCode
    3128383
  • Title

    A Fault-Tolerant Layer for Dynamically Reconfigurable Multi-processor System-on-Chip

  • Author

    Pham, Hung-Manh ; Pillement, Sebastien ; Demigny, Didier

  • Author_Institution
    INRIA, Univ. of Rennes 1, Lannion, France
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    284
  • Lastpage
    289
  • Abstract
    Parallel computing is an important trend of embedded system. One possible response to increasing requirements in computational power is to distribute tasks over various processors and let these processors operate in parallel. Soft-core processors and FPGAs require low Non-Recurring Engineering costs to develop such multi-processors systems. Furthermore, certain FPGAs allow dynamic partial run-time reconfiguration, but their high sensitivity to electronic defects can cause the system disfunction. This paper presents a fault-tolerant multi-processor system-on-chip based on the dynamic reconfiguration of the entire platform. Also, a modification of the standard methodology of the runtime self-reconfiguration, who facilitates the complex modular concept design, is presented in this paper.
  • Keywords
    fault tolerant computing; field programmable gate arrays; microprocessor chips; parallel processing; reconfigurable architectures; system-on-chip; FPGA; dynamic partial run-time reconfiguration; dynamically reconfigurable multiprocessor system-on-chip; fault tolerant layer; nonrecurring engineering; parallel computing; softcore processor; Concurrent computing; Distributed computing; Embedded system; Fault tolerant systems; Field programmable gate arrays; Parallel processing; Power engineering and energy; Power engineering computing; Runtime; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reconfigurable Computing and FPGAs, 2009. ReConFig '09. International Conference on
  • Conference_Location
    Quintana Roo
  • Print_ISBN
    978-1-4244-5293-4
  • Electronic_ISBN
    978-0-7695-3917-1
  • Type

    conf

  • DOI
    10.1109/ReConFig.2009.47
  • Filename
    5382066