Title :
High performance integrated circuit packaging
Author :
Johnson, Barry C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
A tutorial overview is provided of high-performance integrated-circuit packaging. The approach is to (1) present the current trends in circuit performance, (2) discuss their impact on current packaging methods, and (3) present packaging concepts that are being offered as potential solutions. Particular emphasis is placed on design guidelines and material requirements
Keywords :
VLSI; cooling; digital integrated circuits; integrated circuit technology; packaging; ULSI; VLSI; circuit performance; cooling; design guidelines; high performance IC packaging; material requirements; packaging concepts; packaging methods; pincount; potential solutions; trends; tutorial overview; Bipolar integrated circuits; CMOS integrated circuits; CMOS logic circuits; Electronic packaging thermal management; Integrated circuit packaging; Microprocessors; Pins; Random access memory; Semiconductor device packaging; Signal processing;
Conference_Titel :
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location :
Rochester, NY
DOI :
10.1109/CICC.1988.20918
