• DocumentCode
    3128754
  • Title

    Analysis of fatigue damage repair based on laser shock processing for copper film

  • Author

    Li, Ming ; Shang, De-Guang ; Liu, Xiao-Dong ; Jin, Jia ; Chen, Tao ; Guo, Y.B. ; Barkey, M.E.

  • Author_Institution
    Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
  • fYear
    2012
  • fDate
    5-8 Aug. 2012
  • Firstpage
    1277
  • Lastpage
    1281
  • Abstract
    The effect of laser shock processing on fatigue life was investigated for pre-damaged polycrystalline copper film in this study. First, a series of laser shock processing experiments is performed by changing laser power density and number of pulses for the specimens with the same damage degree. The optimal repairing parameters of laser shock processing is identified by comparing with the fatigue lives of specimens before and after laser shock processing. Next, the effect of laser shock processing on the fatigue lives of the damaged and undamaged specimens under identical laser shock processing parameters is investigated. Finally, the opportunity of repair damage for the specimens with different damage degrees is discussed using the optimal processing parameters for the laser shock processing. The results indicated that laser shock processing has a great potential as a means of repairing the fatigue damage for film components.
  • Keywords
    copper; fatigue; laser materials processing; metallic thin films; shock waves; Cu; fatigue damage repair; film components; laser power density; laser pulses; laser shock processing; optimal processing parameters; polycrystalline copper film; shock waves; Copper; Electric shock; Fatigue; Films; Maintenance engineering; Power lasers; Copper film; Fatigue damage repair; Laser shock processing; Surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2012 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4673-1275-2
  • Type

    conf

  • DOI
    10.1109/ICMA.2012.6284319
  • Filename
    6284319