Accurate measurement of high-speed package and interconnect parasitics

Author

Carlton, D.E. ; Gleason, K.R. ; Hopkins, R. ; Jones, K. ; Noonan, K. ; Strid, E.W.

Author_Institution

Cascade Microtech Inc., Beaverton, OR, USA

fYear

1988

fDate

16-19 May 1988

Abstract

Various ideal structures such as small resistors, shorts, and transmission lines are used to verify the calibration of the measurement instrument at the probe tip. Typical measurements of package and interconnect performance are demonstrated, and sample measurements are made, including time domain reflectometry, propagation delay, isolation, and bypassing of power lines. Measurement results are shown

Keywords

calibration; integrated circuit testing; packaging; probes; time measurement; bypassing of power lines; calibration; ideal structures; interconnect parasitics; isolation; measurement instrument; package parasites; probe tip; probing techniques; propagation delay; subnanosecond risetimes; time domain reflectometry; Calibration; Instruments; Packaging; Power measurement; Power transmission lines; Probes; Reflectometry; Resistors; Time measurement; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988

Conference_Location

Rochester, NY

Type

conf

DOI

10.1109/CICC.1988.20920

Filename

20920

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3128894