• DocumentCode
    3128936
  • Title

    Modelling and analysis of power dissipation in single electron logic

  • Author

    Mahapatra, S. ; Ionescu, A.M. ; Banerjee, K. ; Declercq, M.J.

  • Author_Institution
    Electron. Lab., Swiss Fed. Inst. of Technol., Lausanne, Switzerland
  • fYear
    2002
  • fDate
    8-11 Dec. 2002
  • Firstpage
    323
  • Lastpage
    326
  • Abstract
    A new analytical model for Single Electron Transistors (SETs) that can be used for co-simulation with CMOS is developed and validated with Monte Carlo simulation. The model includes temperature dependence, device asymmetry and background charge effects. A detailed physical parameter extraction procedure for asymmetric SETs is reported. An analytical approach is subsequently developed to investigate and accurately predict the power dissipation of SET inverters. Static power, as the main mechanism of SET logic power dissipation, and contributions of dynamic and temperature-dependent leakage power are derived and critically discussed. It is shown that SET asymmetry can be exploited to significantly reduce SET logic power dissipation with negligible impact on propagation delay.
  • Keywords
    Monte Carlo methods; delays; logic gates; low-power electronics; semiconductor device models; single electron transistors; CMOS co-simulation; I-V characteristics; Monte Carlo simulation; SET asymmetry; SET inverters; SETs; analytical model; asymmetric SETs; background charge effects; device asymmetry; dynamic power; physical parameter extraction procedure; power dissipation; propagation delay; single electron logic; single electron transistors; static power; temperature dependence; temperature-dependent leakage power; Analytical models; CMOS logic circuits; Inverters; Logic devices; Parameter extraction; Power dissipation; Propagation delay; Semiconductor device modeling; Single electron transistors; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2002. IEDM '02. International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-7462-2
  • Type

    conf

  • DOI
    10.1109/IEDM.2002.1175844
  • Filename
    1175844