• DocumentCode
    3129076
  • Title

    A fail-safe ESD protection circuit with 230 fF linear capacitance for high-speed/high-precision 0.18 /spl mu/m CMOS I/O application

  • Author

    Lin, Jerry ; Duvvury, Charvaka ; Haroun, Baher ; Oguzman, Ismail ; Somayaji, Ananth

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2002
  • fDate
    8-11 Dec. 2002
  • Firstpage
    349
  • Lastpage
    352
  • Abstract
    Integration of RF/analog and digital circuitry imposes great challenges on Electro-Static-Discharge (ESD) circuit design. Substrate noise coupling through parasitic ESD capacitance degrades the RF/analog input signal, due to both ESD capacitance value and its non-linearity. This paper presents a new 4 kV fail-safe ESD structure, which uses a forward-biased diode to isolate the high capacitance node and uses both N/P junctions and P/N junctions to compensate voltage dependent capacitance. A 230 fF, linear ESD capacitance is achieved without sacrificing the protection capability. This ESD structure uses substrate pumping and sequential booting to trigger as an effective clamp. It also represents total protection including a CDM clamp.
  • Keywords
    CMOS integrated circuits; capacitance; electrostatic discharge; high-speed integrated circuits; integrated circuit design; integrated circuit noise; integrated circuit reliability; mixed analogue-digital integrated circuits; protection; 0.18 micron; 230 fF; 4 kV; CDM clamp; ESD capacitance nonlinearity; N/P junction; P/N junction; RF/analog circuitry integration; RF/digital circuitry integration; accumulation capacitor; fail-safe ESD protection circuit; forward-biased diode; high capacitance node isolation; high-speed/high-precision CMOS I/O application; linear capacitance; parasitic ESD capacitance; sequential booting; substrate noise coupling; substrate pumping; total protection; voltage dependent capacitance compensation; Circuit noise; Circuit synthesis; Clamps; Coupling circuits; Degradation; Electrostatic discharge; Parasitic capacitance; Protection; RF signals; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2002. IEDM '02. International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-7462-2
  • Type

    conf

  • DOI
    10.1109/IEDM.2002.1175850
  • Filename
    1175850