• DocumentCode
    3129486
  • Title

    Welcome message from Shen-Li Fu, conference co-chair

  • Author

    Fu, Shen-Li

  • Author_Institution
    I-SHOU University, China
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    On behalf of the organizing sponsor of the 4th IMPACT International Conference, I would like to extend my sincere appreciation to each and every one of you for your participation and support at the various events of the IMPACT conference. For the past three years, the IMPACT conference has attracted many international well-known experts and scholars attending here to discuss the advanced technology of Microsystems, Packaging, Assembly and Circuit.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382123
  • Filename
    5382123
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3129486