Title :
Welcome message from Shen-Li Fu, conference co-chair
Author_Institution :
I-SHOU University, China
Abstract :
On behalf of the organizing sponsor of the 4th IMPACT International Conference, I would like to extend my sincere appreciation to each and every one of you for your participation and support at the various events of the IMPACT conference. For the past three years, the IMPACT conference has attracted many international well-known experts and scholars attending here to discuss the advanced technology of Microsystems, Packaging, Assembly and Circuit.
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382123
